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Rigid-flex PCB Capability

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Rigid-flex PCB Capability

Items Rigid-flex PCB Capability
Max Layer Count 22 Layers
Min Board Thickness 12 mil(0.30mm)
16 mil (0.40mm)
20 mil (0.50mm)
28 mil (0.70mm)
36 mil (0.9mm)
Max Board Thickness 157 mil(4.0mm)
Max Board Dimension 480*480mm
Max Conductor Thickness 2 OZ (70um)
Min Conductor Thickness 1/2 OZ(18um)
Min Trace Width/Space 4/4mil (0.1/0.10mm)
Min Hole Diameter 4mil (0.1mm)
Min Hole Spacing NPTH: 16mil (0.3mm)
PTH: 20mil (0.5mm)
Max Aspect Ratio 8:01
Min Solder PAD Dia 10mil (0.25mm)
Min PAD Ring(Single Side) 3mil(0.075mm)
PTH Wall Thickness 0.59mil (15um) for normal
PTH Dia Tolerance ± 3 mil (0.075mm)
NPTH Dia Tolerance ± 2 mil (0.05mm)
Hole Position ±4 mil (0.1mm)
Outline Tolerance Laser: +0.15mm/-0.05mm
Die Punch: +0.10mm/-0.2mm
Min Soldermask Bridge 12 mil(0.3mm)
Min BAG PAD Margin 12 mil(0.3mm)
Impedance Controlled Normal: ± 10%
Value≤50 Ohm: ± 5 Ohm
Thermal Conductivity(W/m.K, or W/m.C) 0.30-0.45
Dielectric Strength ≥1.3 KV /mm
Wrap & Twist ≤ 1%
Flammability 94V-0
Surface Treatment ENIG, Flash Gold, Hard Gold Finger, Gold Plating, Selected Gold plating,ENEPIG, ENIPIG.
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